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Wideband 4 GHz, 36 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, Dual SPDT ADG936/ADG936-R
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FEATURES
Wideband switch: -3 dB @ 4 GHz ADG936 absorptive dual SPDT ADG936-R reflective dual SPDT High off isolation (36 dB @ 1 GHz) Low insertion loss (0.9 dB dc to 1 GHz) Single 1.65 to 2.75 V power supply CMOS/LVTTL control logic 20-lead TSSOP and 4 mm x 4 mm LFCSP package Low power consumption (1 A max)
FUNCTIONAL BLOCK DIAGRAMS
RF1A RFCA 50 RF2A INA INA RF2A RFCA RF1A
ADG936
50 RF1B
ADG936-R
RF1B RFCB
APPLICATIONS
Wireless communications General-purpose RF switching Dual-band applications High speed filter selection Digital transceiver front end switch IF switching Tuner modules Antenna diversity switching
RFCB 50 RF2B INB 50
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RF2B INB
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Figure 1.
Figure 2.
GENERAL DESCRIPTION
The ADG936/ADG936-R are wideband analog switches that comprise two independently selectable SPDT switches using a CMOS process to provide high isolation and low insertion loss to 1 GHz. The ADG936 is an absorptive/matched dual SPDT with 50 terminated shunt legs; the ADG936-R is a reflective dual SPDT. These devices are designed such that the isolation is high over the dc to 1 GHz frequency range. They have on-board CMOS control logic, eliminating the need for external controlling circuitry. The control inputs are both CMOS and
-10 -20 -30
OFF ISOLATION (dB)
LVTTL compatible. The low power consumption of these CMOS devices makes them ideally suited for wireless applications and general-purpose high frequency switching.
PRODUCT HIGHLIGHTS
1. 2. 3. -36 dB off isolation @ 1 GHz. 0.9 dB insertion loss @ 1 GHz. 20-lead TSSOP and 4 mm x 4 mm LFCSP package.
-0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 -1.0 -1.1 -1.2 -1.3 -1.4 -1.5 -1.6 -1.7 -1.8 -1.9 -2.0 -2.1 -2.2 -2.3 -2.4 -2.5 -2.6 -2.7 -2.8 -2.9 TA = 25C -3.0 10k 100k
VDD = 2.5V TA = 25C
-40 -50 -60 -70 -80 10k S12
INSERTION LOSS (dB)
VDD = 2.5V
S21
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100k
1M
10M 100M FREQUENCY (Hz)
1G
10G
1M
10M 100M FREQUENCY (Hz)
1G
10G
Figure 3. Off Isolation vs. Frequency
Figure 4. Insertion Loss vs. Frequency
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.8703 (c) 2004 Analog Devices, Inc. All rights reserved.
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ADG936/ADG936-R TABLE OF CONTENTS
Specifications..................................................................................... 3 Absolute Maximum Ratings............................................................ 4 Pin Configurations and Function Descriptions ........................... 5 Terminology ...................................................................................... 6 Typical Performance Characteristics ............................................. 7 Test Circuits....................................................................................... 9 Applications..................................................................................... 11
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Absorptive vs. Reflective ........................................................... 11 Filter Selection ............................................................................ 11 Tx/Rx Switching ......................................................................... 11 Antenna Diversity Switch.......................................................... 11 Evaluation Board ............................................................................ 12 Outline Dimensions ....................................................................... 13 Ordering Guide .......................................................................... 14
REVISION HISTORY
7/04--Revision 0: Initial Version
Rev. 0 | Page 2 of 16
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ADG936/ADG936-R
SPECIFICATIONS
VDD = 1.65 V to 2.75 V, GND = 0 V, Input Power = 0 dBm, all specifications TMIN to TMAX, unless otherwise noted.1 Table 1.
Parameter AC ELECTRICAL CHARACTERISTICS Operating Frequency3 3 dB Frequency4 Input Power4 Insertion Loss Symbol Conditions Min DC 0 V dc bias 0.5 V dc bias DC to 100 MHz; VDD = 2.5 V 10% 500 MHz; VDD = 2.5 V 10% 1000 MHz; VDD = 2.5 V 10% 100 MHz 500 MHz 1000 MHz 100 MHz 500 MHz 1000 MHz DC to 100 MHz 500 MHz 1000 MHz DC to 100 MHz 500 MHz 1000 MHz 50% CTRL to 90% RF 50% CTRL to 10% RF 10% to 90% RF 90% to 10% RF 1000 MHz 900 MHz/901 MHz, 4 dBm B Version Typ2 Max 2 4 7 16 0.5 0.8 1.25 Unit GHz GHz dBm dBm dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB ns ns ns ns dBm dBm mV p-p V V V V A pF pF 2.75 1 V A
S21, S12
Isolation--RFCx to RF1x/RF2x
S21, S12
Crosstalk--RF1x to RF2x
S21, S12
Return Loss (On Channel)4
S11, S22
Return Loss (Off Channel)4
S11, S22
52 40 31 53 42 34 20 19 16 18 17 16
On Switching Time4 Off Switching Time4 Rise Time4 Fall Time4 1 dB Compression4 Third-Order Intermodulation Intercept Video Feedthrough5 DC ELECTRICAL CHARACTERISTICS Input High Voltage Input Low Voltage Input Leakage Current CAPACITANCE4 RF Port On Capacitance Digital Input Capacitance POWER REQUIREMENTS VDD Quiescent Power Supply Current
tON tOFF tRISE tFALL P-1 dB IP3
29
0.4 0.6 0.9 60 47 36 69 45 37 25 23 24 24 23 21 11 10 6.1 6 16 32 3
14 13 8 8
VINH VINH VINL VINL II CRF ON CDIG
VDD = 2.25 V to 2.75 V VDD = 1.65 V to 1.95 V VDD = 2.25 V to 2.75 V VDD = 1.65 V to 1.95 V 0 VIN 2.75 V f = 1 MHz f = 1 MHz
1.7 0.65 VCC 0.7 0.35 VCC 1
0.1 2.5 2 1.65
IDD
Digital inputs = 0 V or VDD
0.1
1 2 3
Temperature range B Version: -40C to +85C. Typical values are at VDD = 2.5 V and 25C, unless otherwise noted. Operating frequency is the point at which insertion loss degrades by 1 dB. 4 Guaranteed by design, not subject to production test. 5 Video feedthrough is the dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 test setup, measured with 1 ns rise time pulses and 500 MHz bandwidth.
Rev. 0 | Page 3 of 16
ADG936/ADG936-R ABSOLUTE MAXIMUM RATINGS
TA = 25C, unless otherwise noted. Table 2.
Parameter VDD to GND Inputs to GND Continuous Current Input Power Operating Temperature Range Industrial (B Version) Storage Temperature Range Junction Temperature TSSOP Package JA Thermal Impedance LFCSP Package JA Thermal Impedance (4-layer board) Lead Temperature, Soldering (10 s) IR Reflow, Peak Temperature (<20 s) ESD Rating -0.5 V to +4 V -0.5 V to VDD + 0.3 V1 30 mA 18 dBm -40C to +85C -65C to +150C 150C 143C/W 30.4C/W 300C 235C 1 kV
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Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
Table 3. Truth Table
INx 0 1 RF1x Off On RF2x On Off
1
RF1x/RF2x Off Port Inputs to Ground = -0.5 V to VDD - 0.5 V.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 4 of 16
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ADG936/ADG936-R
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
18 RFCA
RFCA 1 VDD 2 GND 3 RF1A 4 GND 5 GND 6 RF1B 7 GND 8 GND 9 RFCB 10
20 19
GND
20 GND 19 VDD
17 GND
INA GND RF2A
GND 1 RF1A 2 GND 3 GND 4 RF1B 5
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ADG936 ADG936-R
18 17
16 INA
16 GND TOP VIEW (Not to Scale) 15 GND 14 13 12 11
15 GND
ADG936 ADG936-R
TOP VIEW (Not to Scale)
14 RF2A 13 GND 12 GND 11 RF2B
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RF2B GND INB GND
GND 6
GND 7 RFCB 8
Figure 5. 20-Lead TSSOP (RU-20)
Figure 6. 20-Lead 4 mm x 4 mm LFCSP (CP-20)
Table 4. Pin Function Descriptions
Pin No. 20-Lead 20-Lead TSSOP LFCSP 1 18 2 19 3, 5, 6, 8, 9, 11,13, 15, 16, 18, 20 4 7 10 12 14 17 19 1, 3, 4, 6, 7, 9, 12,13, 15, 17, 20 2 5 8 10 11 14 16
Mnemonic RFCA VDD GND
Function Common RF Port for Switch A. Power Supply Input. These parts can be operated from 1.65 V to 2.75 V. VDD should be decoupled to GND. Ground Reference Point for All Circuitry on the Part.
RF1A RF1B RFCB INB RF2B RF2A INA
RF1A Port. RF1B Port. Common RF Port for Switch B. Logic Control Input. RF2B Port. RF2A Port. Logic Control Input.
Rev. 0 | Page 5 of 16
GND 9 INB 10
ADG936/ADG936-R TERMINOLOGY
Table 5.
Parameter VDD IDD GND INx VINL VINH IINL (IINH) CIN tON tOFF tRISE tFALL Off Isolation Insertion Loss Crosstalk P-1 dB IP3 Return Loss
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Video Feedthrough
Description Most Positive Power Supply Potential. Positive Supply Current. Ground (0 V) Reference. Logic Control Input. Maximum Input Voltage for Logic 0. Minimum Input Voltage for Logic 1. Input Current of the Digital Input. Digital Input Capacitance. Delay between Applying the Digital Control Input and the Output Switching On. Delay between Applying the Digital Control Input and the Output Switching Off. Rise Time. Time for the RF signal to rise from 10% of the On level to 90% of the On level. Fall Time. Time for the RF signal to fall from 90% of the On level to 10% of the On level. The Attenuation between Input and Output Ports of the Switch when the Switch Control Voltage Is in the Off Condition. The Attenuation between Input and Output Ports of the Switch when the Switch Control Voltage Is in the On Condition. Measure of Unwanted Signal Coupled through from One Channel to Another as a Result of Parasitic Capacitance. 1 dB Compression Point. The RF input power level at which the switch insertion loss increases by 1 dB over its low level value. P-1 dB is a measure of how much power the On switch can handle before the insertion loss increases by 1 dB. Third-Order Intermodulation Intercept. This is a measure of the power in false tones that occurs when closely spaced tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated. The Amount of Reflected Power Relative to the Incident Power at a Port. Large return loss indicates good matching. By measuring return loss, the VSWR can be calculated from conversion charts. VSWR (voltage standing wave ratio) indicates the degree of matching present at a switch RF port. Spurious Signals Present at the RF Ports of the Switch when the Control Voltage Is Switched from High to Low or Low to High without an RF Signal Present.
Rev. 0 | Page 6 of 16
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ADG936/ADG936-R
TYPICAL PERFORMANCE CHARACTERISTICS
-0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 -1.0 -1.1 -1.2 -1.3 -1.4 -1.5 -1.6 -1.7 -1.8 -1.9 -2.0 -2.1 -2.2 -2.3 -2.4 -2.5 -2.6 -2.7 -2.8 -2.9 TA = 25C -3.0 10k 100k -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 -1.0 -1.1 -1.2 -1.3 -1.4 -1.5 -1.6 -1.7 -1.8 -1.9 -2.0 -2.1 -2.2 -2.3 -2.4 -2.5 -2.6 -2.7 -2.8 -2.9 VDD = 2.5V -3.0 10k 100k TA = -40C TA = +25C TA = +85C
VDD = 2.75V
INSERTION LOSS (dB)
04503-0-015
INSERTION LOSS (dB)
VDD = 2.50V
VDD = 2.25V
1M
10M 100M FREQUENCY (Hz)
1G
10G
1M
10M 100M FREQUENCY (Hz)
1G
10G
Figure 7. Insertion Loss vs. Frequency over Supplies (S12 and S21)
Figure 10. Insertion Loss vs. Frequency over Temperature ( S12 and S21)
-0.3 -0.4 -0.5 -0.6 -0.7 VDD = 2.25V -0.8 -0.9
04503-0-016
-10 -20 -30
OFF ISOLATION (dB)
VDD = 1.65V TO 2.75V TA = 25C
INSERTION LOSS (dB)
VDD = 2.75V VDD = 2.50V
-40 -50 -60 -70 -80 10k S12
S21
1M
10M 100M FREQUENCY (Hz)
1G
10G
100k
1M
10M 100M FREQUENCY (Hz)
1G
10G
Figure 8. Insertion Loss vs. Frequency over Supplies (S12 and S21)(Zoomed Figure 7)
Figure 11. Isolation vs. Frequency over Supplies
04503-0-017
1M
10M 100M FREQUENCY (Hz)
1G
10G
-110 10k
100k
1M 10M 100M FREQUENCY (Hz)
1G
10G
Figure 9. Insertion Loss vs. Frequency over Supplies (S12 and S21)
Figure 12. Isolation vs. Frequency over Temperature
Rev. 0 | Page 7 of 16
04503-0-020
-0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 -1.0 -1.1 -1.2 -1.3 -1.4 -1.5 -1.6 -1.7 -1.8 -1.9 -2.0 -2.1 -2.2 -2.3 -2.4 -2.5 -2.6 -2.7 -2.8 -2.9 TA = 25C -3.0 10k 100k
-10 VDD = 2.5V -20 -30 VDD = 1.95V VDD = 1.80V VDD = 1.65V
OFF ISOLATION (dB)
INSERTION LOSS (dB)
-40 -50 -60 -70 -80 -90 -100 TA = -40C TA = +25C TA = +85C
04503-0-019
T = 25C -1.0 A 10k 100k
04503-0-018
ADG936/ADG936-R
0 VDD = 2.5V TA = 25C
TEK RUN [T]
T
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TRIG'D : 2.20mV
-5
INx
RETURN LOSS (dB)
-10
1
-15
-20
3
OFF SWITCH -25 ON SWITCH
RFCx
100k
1M
10M 100M FREQUENCY (Hz)
1G
10G
CH1 1.00V CH3 1.00mV
20.0ns
Figure 13. Return Loss vs. Frequency ( S11)
35 30 25 20 15 10 5
04503-0-022
Figure 16. Video Feedthrough
-10 -20 -30
CROSSTALK (dB)
-40 -50 -60 -70 -80 -90 10k VDD = 2.5V TA = 25C 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G
IP3 (dB)
0 100
200
300
400 500 600 FREQUENCY (MHz)
700
800
900
Figure 14. Crosstalk vs. Frequency (S12 and S21)
TEK RUN: 5.00GS/s ET ENVELOPE [ INx 18 T ] 16 14 12 1
P-1dB (dBm)
Figure 17. IP3 vs. Frequency
10 8 6 4 2 0 VDD = 2.5V TA = 25C 0 250 500 750 1000 FREQUENCY (MHz) 1250 1500
3 RFx
CH1 CH3
1.00V 100mV
CH2
100mV
5.00ns
Figure 15. Switch Timing
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Figure 18. P-1 dB vs. Frequency
Rev. 0 | Page 8 of 16
04503-0-025
04504-0-019
VDD = 2.5V TA = 25C
04503-0-024
-30 10k
04503-0-021
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ADG936/ADG936-R
TEST CIRCUITS
Similar setup for the ADG936. Additional pins omitted for clarity.
VDD 10F
VDD
10F
VOUT VDD
ADG936-R
RF1x 50
RL 50 NETWORK ANALYZER
VDD RFCx RFx VOUT 50% VS INx GND RL 50 VINx VOUT 90% 10%
04503-0-004
RFCx
50%
INx
RF2x
50
VS
tON
tOFF
INSERTION LOSS = 20log
VOUT VS
Figure 19. Switch Timing: tON, tOFF
Figure 22. Insertion Loss
VDD 10F
VDD 10F
VDD
ADG936-R
RF1x
NETWORK ANALYZER 50
VDD RFCx RFx VOUT RL 50 GND VINx VOUT 10% 90% 90% 10% 50% 50%
RFCx 50 INx RF2x RL 50
VS
VOUT
VS
INx
VINx
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GND VOUT VS
04503-0-008
tRISE
tFALL
CROSSTALK = 20log
Figure 20. Switch Timing: tRISE, tFALL
Figure 23. Crosstalk
VDD 10F
10F
VDD
VDD
ADG936-R
RF1x
50
VS
VDD
ADG936-R
RF1x NC
RFC
RL 50
VOUT
OSCILLOSCOPE
RFCx NC
INx
RF2x
50
NETWORK ANALYZER
INx
04503-0-006
RF2x
VINx
GND V OFF ISOLATION = 20log OUT VS
VINx
04503-0-009
GND
Figure 21. Off Isolation
Figure 24. Video Feedthrough
Rev. 0 | Page 9 of 16
04503-0-007
VINx
GND
ADG936/ADG936-R
VDD 10F
10F VDD
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VDD
ADG936-R
RF1x 50 RF SOURCE
VDD
ADG936-R
RF1x 50
SPECTRUM RFCx ANALYZER INx RF2x
SPECTRUM ANALYZER
RFCx RF SOURCE VS
COMBINER
INx RF2x
04503-0-010
Figure 25. IP3
Figure 26. P-1 dB
Rev. 0 | Page 10 of 16
04503-0-011
VINx
GND
RF SOURCE
VINx
GND
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ADG936/ADG936-R
APPLICATIONS
The ADG936/ADG936-R are ideal solutions for low power, high frequency applications. The low insertion loss, high isolation between ports, low distortion, and low current consumption of these parts make them excellent solutions for many high frequency switching applications. They can be used in applications such as switchable filters, transmitters and receivers for radar systems, and communication systems from base stations to cell phones. The ADG9xx family of wideband switches is designed to meet the demands of devices transmitting at ISM band frequencies to 1 GHz and higher. The low insertion loss, high isolation between ports, single pin control interface, no requirement for dc blocking capacitors, and TTL interface compatibility make them cost-effective and easy-to-integrate switching solutions for many high frequency switching and low power applications, because the parts can handle up to 16 dBm of power.
FILTER SELECTION
The ADG936 and ADG936-R can be used to switch high frequency signals between different filters, and to multiplex the signal to the output. These dual SPDT switches are also ideal for high speed signal routing and for switching high speed differential signals.
RF1A RFIN
RF1A RFOUT
RFCA
RF2A
RF2A
ADG936
RF1B RF1B
ADG936
RFCA
RFIN
RF2B
RF2B
Figure 27. Filter Selection
Tx/Rx SWITCHING
The low insertion loss and high isolation between ports ensure that the ADG936/ADG936-R are suitable transmit/receive switches for all ISM band and Wireless LAN applications, providing the required isolation between the transmit and receive signals.
LNA ANTENNA RFCA
ABSORPTIVE VS. REFLECTIVE
The ADG936 is an absorptive (matched) switch with 50 terminated shunt legs; the ADG936-R is a reflective switch with 0 terminated shunts to ground. The ADG936 absorptive switch has a good VSWR on each port, regardless of the switch mode. An absorptive switch should be used when there is a need for a good VSWR that is looking into the port but not passing the through-signal to the common port. The ADG936 is, therefore, ideal for applications that require minimum reflections back to the RF source. It also ensures that the maximum power is transferred to the load. The ADG936-R reflective switch is suitable for applications in which high off-port VSWR does not matter, and the switch has some other desired performance features. It can be used in many applications, including high speed filter selection. In most cases, an absorptive switch can be used instead of a reflective switch, but not vice versa.
PA
ADG936
RFCB RF1B RF1B
04504-0-014
RF2B
RF2B
Figure 28. Tx/Rx Switching
ANTENNA DIVERSITY SWITCH
The ADG936/ADG936-R are ideal for use as antenna diversity switches, switching in different antennas to the tuner. The low insertion loss, which ensures minimum signal loss and high isolation between channels, makes these dual SPDT switches suitable for switching applications in tuner modules and set-top boxes.
Rev. 0 | Page 11 of 16
04504-0-013
RFCB
RFCB
RFOUT
ADG936/ADG936-R EVALUATION BOARD
The ADG936 and ADG936-R evaluation board allows designers to evaluate these high performance wideband switches with minimal effort. To prove that these devices meet the user's requirements, only a power supply and a network analyzer, along with the evaluation board, are required. An application note available with the evaluation board gives complete information on operating the evaluation board. The RFCA port is connected through a 50 transmission line to SMA connector J3. The RFCB port is connected through a 50 transmission line to SMA connector J4. RF1A, RF2A, RF1B, and RF2B are connected through 50 transmission lines to SMA connectors J5, J6, J7, and J8, respectively. A through transmission line connects J9 and J10; this transmission line is used to estimate the loss of the PCB over the environmental conditions being evaluated. The board is constructed of a four-layer, FR4 material with a dielectric constant of 4.3 and an overall thickness of 0.062 in. Two ground layers with grounded planes provide ground for the RF transmission lines. The transmission lines were designed using a coplanar waveguide with ground plane model using a trace width of 0.024 in, clearance to ground plane of 0.008 in, dielectric thickness of 0.02 in, and a metal thickness of 0.0021 in.
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Figure 29. ADG936 and ADG936-R Evaluation Board Top View
Rev. 0 | Page 12 of 16
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ADG936/ADG936-R
OUTLINE DIMENSIONS
6.60 6.50 6.40
20
11
4.50 4.40 4.30 6.40 BSC
1 10
PIN 1 0.65 BSC 0.15 0.05 COPLANARITY 0.10 0.30 0.19 1.20 MAX 0.20 0.09 8 0 0.75 0.60 0.45
SEATING PLANE
COMPLIANT TO JEDEC STANDARDS MO-153AC
Figure 30. 20-Lead Thin Shrink Small Outline Package [TSSOP] (RU-20) Dimensions shown in millimeters
4.00 BSC SQ 0.60 MAX PIN 1 INDICATOR TOP VIEW 3.75 BCS SQ 0.75 0.55 0.35 12 MAX 1.00 0.85 0.80 SEATING PLANE 0.80 MAX 0.65 TYP 0.05 MAX 0.02 NOM 0.50 BSC 0.20 REF
0.60 MAX
16 15 EXPOSED PAD
20 1
(BOTTOM VIEW)
2.25 2.10 SQ 1.95
5
11 10
6
0.25 MIN 0.30 0.23 0.18
COPLANARITY 0.08
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Figure 31. 20-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm x 4 mm Body (CP-20-1) Dimensions shown in millimeters
Rev. 0 | Page 13 of 16
ADG936/ADG936-R
ORDERING GUIDE
Model ADG936BRU ADG936BRU-500RL7 ADG936BRU-REEL ADG936BRU-REEL7 ADG936BCP ADG936BCP-500RL7 ADG936BCP-REEL ADG936BCP-REEL7 ADG936BRU-R ADG936BRU-R-500RL7 ADG936BRU-R-REEL ADG936BRU-R-REEL7 ADG936BCP-R ADG936BCP-R-500RL7 ADG936BCP-R-REEL ADG936BCP-R-REEL7 EVAL-ADG936EB EVAL-ADG936-REB Temperature Range -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C Package Description Thin Shrink Small Outline Package (TSSOP) Thin Shrink Small Outline Package (TSSOP) Thin Shrink Small Outline Package (TSSOP) Thin Shrink Small Outline Package (TSSOP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Thin Shrink Small Outline Package (TSSOP) Thin Shrink Small Outline Package (TSSOP) Thin Shrink Small Outline Package (TSSOP) Thin Shrink Small Outline Package (TSSOP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Evaluation Board Evaluation Board
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Package Option RU-20 RU-20 RU-20 RU-20 CP-20-1 CP-20-1 CP-20-1 CP-20-1 RU-20 RU-20 RU-20 RU-20 CP-20-1 CP-20-1 CP-20-1 CP-20-1 RU-20 RU-20
Rev. 0 | Page 14 of 16
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ADG936/ADG936-R
NOTES
Rev. 0 | Page 15 of 16
ADG936/ADG936-R NOTES
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(c) 2004 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D04503-0-7/04(0)
Rev. 0 | Page 16 of 16

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